RENA Technologies at SEMICON Taiwan 2025: Driving Innovation in Semiconductor Wet Processing

RENA Technologies proudly presented itself at SEMICON Taiwan 2025, held from September 10–12 at TaiNex 1, Taipei. At Booth, we showcased our proven semiconductor wet processing solutions for glass wafer processing, semiconductor manufacturing, and compound materials - strengthening our role as a trusted partner in the industry.

Our equipment is designed to deliver high throughput, reliable process control, and low chemical and water consumption, meeting the demanding standards of modern semiconductor production.

In Focus: Batch Wafer Processing & Advanced Glass Applications
Visitors experienced our latest innovations:

• RENA Convergence – high-throughput batch wafer processing platform for 150/200/300 mm wafers. Key benefits include flexible wafer sizes, optimized fluid control for low chemical and water use, and full SECS/GEM 300 compliance.

• Revolution+ – compact automated wet bench for multi-step wafer processing. Highlights include high capacity up to 70,000 wafers/month, dry-to-dry process with ISO3/class1 cleanroom compliance, and efficient rotary robot handling, and flexible SECS/GEM interface options for seamless fab integration.

• BatchGlass P3 (TGV) – advanced glass wafer etching tool for through glass via (TGV) applications. Main advantages are large format panel support (up to 510×515 mm), excellent etch homogeneity and surface cleanliness, and SEMI/GEM300 compliance for pilot and high-volume production.

Global Expertise – Local Support
At RENA, we accompany our customers across the entire lifecycle of their equipment – with state-of-the-art wet processing equipment, tailored solutions, and a worldwide service network.

We sincerely thank all visitors and partners who joined us at SEMICON Taiwan 2025. Together, we continue to advance semiconductor manufacturing, glass wafer cleaning, and wet chemical etching for the future.

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⇒ Are you interested in our wet chemical systems? Please contact our sales team.