Electroplating Technology for industrial uses

Electroplating

Electrochemical deposition is a flexible low-cost technology of fabrication of a wide variety of two- and three-dimensional coatings or films. As the name suggests, the process involves depositing material using an electric current. The electroplating process uses an electric current to dissolve metal and deposit it onto a surface.

With more than 20 years of electrochemical deposition (ECD) experiences RENA has gained process and technology know-how in the Solar, Medical and Semiconductor segment. RENAs abilities range from validated low-cost high throughput electrochemical deposition technologies to high precision methods for best uniformity results and optimal combinations of both.

Semiconductor Plating

In the semiconductor business, RENA is a strong partner for ECD applications for the device manufacturing for optoelectronic, microelectronic devices and photonic chips. Wafer sizes from 2 to 8 inch, as well as small scale panel substrates can be easily handled. Various plating metals such as Cu, Sn, Ni, Au, Ag, In, Pt and allowys such as SnPb, SnAg, NiFe, CoNiFe on substrates with substrate thickness between 350 and 1000 µm can be realized. Depending on the application requirements different plating technologies can be applied: vertical rack, fountain, cup and fully customized plating.

Products

EPM 2

Manual electroplating platform with flexible modular design, enabling precise control of electric field, superior uniformity and scalable plating rates.