TruEtch^TM is a tank technology developed by RENA Technologies for wet chemical metal pattern etching in semiconductor manufacturing. This immersion process has been specifically designed to optimize the flow dynamics of process chemicals inside the etching tank, resulting in exceptional process uniformity and highly reproducible etching performance.

A key feature of the technology is the combination of wafer rotation and controlled micro-N₂ bubble movement within the immersion tank. This innovative process concept enables highly uniform metal etching by optimizing the distribution of process chemicals while minimizing localized flow variations. The wafers are continuously and evenly supplied with fresh process chemistry, creating a homogeneous process environment across the entire wafer surface as well as throughout the complete wafer batch.

Unlike conventional etching tanks, TruEtch^TM provides controlled fluid dynamics that minimize process variations and ensure consistent processing of every wafer. The result is outstanding etch uniformity, excellent reproducibility, and stable process conditions at comparatively low operating costs, the key requirements for modern semiconductor manufacturing.

TruEtch^TM enables manufacturers to perform demanding metal pattern etching processes for copper (Cu), aluminum (Al), titanium tungsten (TiW), and noble metals such as gold (Au), silver (Ag), and platinum (Pt) with high reliability and efficiency.