FluidJet – resist and metal lift-off semiconductor wafer processing

FluidJet(TM) - Metal Lift-Off Processing

In micro structuring technology, metal lift-off is used to pattern the semiconductor substrates for fabrication of integrated circuits (ICs) as well as other microelectronic devices. For this purpose, RENA offers the unique Fluidjet^TM immersion tank technology which provide reliable improved lift-off performance together with increased throughput. This outstanding metal removal has been achieved via utilizing precise hydraulic forces combined with robot agitation. Fluidjet^TMtank technology can be incorporated into our fully and semi automated wet benches. RENA’s metal lift-off tank design has been patented and protected in USA, Europe and Asia.

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Features and benefits

Lower Cost & higher throughput than single wafer processing
Over 99 % reclaim of precious metals
Improved lift-off performance
No metal redeposition
No backside redeposition
Reduced damage
80 % reduction in chemical usage
No complex wafer handling
Smaller footprint
Patented & Field-proven Process
No scratching or lifting on gate layers
Solvent Use Avg < = 40ml / Wafer Processed
Reduced Scrap
Auto-clean post-process to maximize uptime
Ultrasonic or Megasonic Available
Fluid and air handling flow modeling
Accessible and removable screens provide rapid cleanouts
Qualified and tested at the factory
Batch immersion eliminates spray control issues

Solving Key Metal Lift-Off Issues

Low Throughput – Immersion and Single Chamber Single wafer tools are much slower requiring multiple tools for production needs
Scrap Due To Handling – Operators handling wafers to inspect, manually peal or spray off re-deposited metal, Robot transfer arm drift
Re-deposition Of Metal – Tanks & Chambers leave metal pieces in suspension in the soak/strip process causing subsequent focus errors in photo and yield loss/shorts
Device Damage – Scratching due to metal debris in suspension or being stripped across the wafer contacting devices at relatively high speed and force
Equipment Cost – Single wafer tools cost more than $1.5 million for comparable WPH
Solvent Usage – High consumption of solvent 1.5 –2.3 L/wafer w/spray @ 1200-1800 PSI Precious Metal Loss – Due to chamber rinse cycles (drain manifold), messy cleanouts (Glitter)
High Level Of PM Requirements – Regular metal cleanouts are required to avoid drain valve or filter clogs and flow system component damage due to excessive PM requirements, messy chamber cleanouts, nozzle replacements, robot arm drift realignment with single wafer tools

Platforms

Evolution

Evolution Fully automated, linear, high-throughput semiconductor immersion wet processing platform with modular design

Revolution

Revolution Semi automated, low-thoughput immersion wet bench with rotary robot for multi-step processes

Advancer

Advancer Semi automated and low-thoughput series of immersion platforms with extremely low footprint