semiconductor wafer

Revolution+

Compact automated wet bench for multi-step processes

For multi-step semiconductor processes, RENA offers the compact Revolution+, a flexible, automated wet bench featuring a central rotary robot and up to three process and three rinsing tanks and integrated drying. This platform is designed for efficient surface treatment, including etching, cleaning, and resist stripping, and is ideal for both FEoL and BEoL applications. With RENA software, the Revolution+ provides advanced process control and monitoring. Specialized configurations, such as patented metal etching can be integrated based on customer requirements. The “Revolution+” combines a small footprint with low water and chemical consumption, offering a highly efficient, cost-effective solution.

Features and Benefits

  • Lowest footprint bridge tool for up to 70,000 wpm
  • 150 mm and 200 mm wafer sizes simultaneously
  • Efficient rotary robot
  • SECS/GEM interface options
  • Dry-to-Dry capabilities
  • ISO3/class1 cleanroom environment
  • Fab integration
    via loadports or automatic/manual drawer
  • Precise process control
  • Low consumption of water & chemistry through superior fluid control and tank design
Theo-Moissidis-Head-of-Sales
VP Sales
Theo Moissidis
ResponsibleResponsible for the following countries:
Worldwide