Your partner in flexible automation for semiconductor wet processing

Discover your ultimate destination for versatile, fully automated wet processing systems in semiconductor manufacturing in our video. Our solutions are customized to meet the needs of various wafer types – including Silicon (Si), Silicon Carbide (SiC), Gallium Nitride (GaN), Gallium Arsenide (GaAs), Indium Phosphide (InP), and even glass panels –­ in a range of sizes and thicknesses.

We excel in seamless semiconductor fab integration, offering limitless handling options such as SMIF, FOUP, LMC, carrier-free, and AGV systems. Our state-of-the-art systems combine advanced wet chemical etching, cleaning, and drying processes to support both front-end-of-line (FEOL) and back-end-of-line (BEOL) applications.

With over 25 years of industry experience, we blend proven platforms with custom-designed systems to push the boundaries of innovation in semiconductor wet processing. Whether you require batch, single wafer, or spray equipment, we deliver precise process control, high throughput, and compact system footprints to achieve industry-leading performance.

RENA Technologies is your trusted source for flexible automation solutions in semiconductor wet processing.

» Click here to watch the video

» Are you interested in our wet chemical systems? Please contact our sales team.