SEMICON West 2026: RENA Opens Up New Possibilities in Metallization

Compact equipment, patented processes and a new electroplating platform: At SEMICON West 2026, RENA Technologies presented wet processing solutions for FEOL and BEOL applications in photonics, RF and power electronics.

At Booth #2066, our patented Metal Lift-Off and Metal Etch solutions took center stage. Integrated into RENA’s wet processing platforms, they combine scalable performance with a small equipment footprint.

Another highlight was the new fully automated electroplating platform for depositing metals such as copper, nickel, gold, tin, silver, indium and platinum, as well as alloys.

Thank you to everyone who visited us to discuss their applications and production requirements. Our team looks forward to continuing these conversations and identifying suitable equipment solutions together.

For more information about our wet processing solutions and electroplating platforms, please contact our team.