TGV Geometry for Glass-Core Packaging: RENA at ISMP 2026

How can etching be used to adjust the shape of through-glass vias (TGVs)? RENA Technologies addressed this question at the International Symposium on Microelectronics Packaging (ISMP 2026), sharing its work on glass processing for glass-core packaging substrates.

The presentation, “Tuning of through glass via (TGV) shapes through etching in glasses for glass-core packaging Substrates”, explored how the etching process can be adjusted to achieve the required via shape.

Why TGV Shape Matters for Glass-Core Substrates

Through-glass vias provide vertical interconnections in glass-core substrates. Controlling their geometry is an important part of achieving reliable interconnects for microelectronics packaging. RENA’s contribution focused on the role of wet chemical etching in tuning TGV geometry to meet application requirements.

Technical Exchange on Wet Processing

RENA’s glass team thanks everyone who attended the presentation and the organisers for enabling this technical exchange. Special thanks go to WOOWON Technology for representing RENA Technologies at the symposium.

For more information on TGV etching and wet processing for glass-core packaging substrates, contact the RENA Technologies glass team to discuss your application requirements.