January 09, 2026
New video: Demo Sampling for Through-Glass Via (TGV) Processing
We provide customized demo sampling services for glass panel processing, specifically optimized for Through-Glass Via (TGV) applications in advanced packaging and glass interposer technologies. Our demo platform enables customers to validate, optimize, and fine-tune TGV process concepts under realistic, production-relevant conditions.
The demo tools can be precisely adapted to individual requirements, including glass substrate type, panel format, and target via geometry, supporting reliable microvia formation, high process uniformity, and improved yield in panel-level manufacturing.
By utilizing a proven alkaline wet-etch process, our TGV tools achieve extremely low via taper angles below 1°, enabling high-density TGV layouts, optimized electrical performance, and robust high-density interconnect (HDI) designs.
To ensure a seamless transfer from demo sampling to scalable production, we offer two dedicated tool platforms tailored to different development stages, automation levels, and volume requirements:
Optimized for panel-level TGV processing (515 × 510 mm)
Fully automated system including EFEM & SECS/GEM
Designed in compliance with SEMI standards
Suitable for pilot lines up to high-volume manufacturing (HVM)
Supports wafer and panel formats up to 600 × 600 mm
Semi-automated tool concept
Ideal for R&D, laboratory, and pilot line applications
» Click here to watch the video
» For further information on glass-related topics, please click here
» If you would like to get in touch with our sales team, we look forward to hearing from you
