The InPolySide® 3+ provides superior rear side and edge etching for TOPCon applications. Poly-Si wrap around from LPCVD and PECVD is removed. With high throughput and full flexibility wafer size is the tool ready for the next generation of solar cells. Designed as a space saving one-tool solution, the InPolySide® covers pre-oxide etch, poly-etching, cleaning or glass etching and rinsing steps. No additional wafer handling is required.