Driving Semiconductor Innovation: RENA Technologies on the I.S.E.S. Japan 2025 Stage

RENA Technologies GmbH was delighted to take the stage at I.S.E.S. Japan 2025, one of the leading global events for semiconductor innovation.
During our presentation, “Tailoring Through Glass via (TGV) Dimensions for Glass-Core Panel Substrates,” we highlighted how cutting-edge glass-core substrates, precise TGV processing, and advanced packaging technologies are accelerating the development of next-generation semiconductor devices.

Wet Processing Excellence for Next-Generation Chips

With decades of expertise in wet processing technologies, RENA Technologies supports global semiconductor manufacturers with:

• High-precision TGV processing and TGV etching

• Advanced glass substrate processing for semiconductor applications

• Wet etching solutions enabling high-density packaging

• Chemical surface treatment for silicon, compound, and glass substrates

• Scalable wet processing systems for modern semiconductor fabs

These processes form the technological foundation for microfabrication, high-density packaging, and the production of next-generation semiconductor devices.

I.S.E.S. – A Global Platform for Semiconductor Leadership

The International Semiconductor Executive Summit (I.S.E.S.) brings together leading innovators, technology experts, materials specialists, and semiconductor decision-makers from around the world.
It serves as a trusted platform for collaboration, knowledge exchange, and strategic partnerships in the semiconductor ecosystem.

We extend our sincere thanks to the International Semiconductor Industry Group, as well as all organizers, speakers, and participants, for creating an inspiring and impactful event that drives global semiconductor innovation.

⇒ Click here to get to our wet chemical solutions

⇒ Are you interested in our wet chemical systems? Please contact our sales team.