chemical wet bath

Hi-ETA clean®

Boost your efficiency

The new Hi-ETA clean® additive with proven efficiency gain of 0.05 % without increasing the footprint of the tool. Designed for cleaning of monocrystalline p- and n-type Si-wafers the additive boosts your production in combination with new or existing Inline PSG/BSG etch (InEchSide), BatchTex N400 or N600 tools.

Features and benefits

  • Enhanced metal cleaning with HF/HCl
  • Increase of the metal clean bath lifetime up to 600 runs
  • Proven efficiency gain of 0.05 % in TOPCon production lines
  • Easy upgrade of existing lines to the new cleaning technology
  • Large process window
  • Cost effective usage of additive
  • Environmental-friendly
Michael Vees Sales Director Solar
Sales Director Solar
Michael Vees